| 摘要 |
PURPOSE:To simplify a process for forming plating films for enhancing corrosion resistance, solderability, etc., and, consequently, to provide the inexpensive electronic parts having excellent reliability. CONSTITUTION:The plating films formed on electrodes 3d, 3e for wirings and other electrodes 4a, 5a of a ceramic substrate 1 constituted by forming the plating films on the electrodes 3d, 3e for wirings formed on the front surface 2a of a ceramic body 2 and the electrodes 4a, 5a formed on the flanks 2b, 2c and back surface 3d of this body are constituted of the same material and these plating films have the first plating layers 8a, 8b consisting of Ni and the second plating layers 9a, 9b consisting of Sn. These electronic parts are constituted of the ceramic substrate 1. |
