SMD components simultaneous removal assembly - has component conveyor arranged in direction of gravity below submerged circuit boards in desoldering bath

摘要

The apparatus includes a desoldering bath (3) which can be heated to the soldering temp. A transport system (2) moves the circuit boards (1), and a component conveyor (6) removes the components. The transport system submerges the circuit boards up to their upper edges in to the desoldering bath until the solder connections melt, and then removes the circuit boards. The component conveyor is arranged in the direction of gravity below the submerged circuit boards, and removes the desoldered surface mount devices (5) which have fallen from the circuit boards, from the desoldering bath. USE/ADVANTAGE - Removes SMDs from PCBs automatically, quickly and without damage.