| 摘要 |
<p>PURPOSE:To obtain a method of forming solder bumps of sufficient height by using a thin screen. CONSTITUTION:Via a screen 10 wherein apertures 11 are formed at positions corresponding with bonding pads 2 of a semiconductor wafer 1, solder paste 12 is transferred on each bonding pad 2, and the wafer 1 on which solder paste 12 is transferred is heat-treated. Thereby a solder bump 14 is formed on each of the bonding pad 2. The area of the aperture 11 formed in the screen 10 is set larger than that of the bonding pad 2.</p> |
