| 摘要 |
PURPOSE:To make safe testing of the electrical characteristics possible and also to realize high density mounting with good moisture resistance in the method of directly mounting semiconductor chips on a printed circuit board. CONSTITUTION:After covering a semiconductor chip 1, an interconnection terminal part 22, and a bonding wire 3 with a first resin 19, electrical tests are conducted by contacting the probes to electrical testing parts 21 that are exposed outside the first resin 19, and the final sealing is done by covering the first resin 19 and the electrical testing parts 21 with a second resin 29. |
