Apparatus for polishing chamfers of a wafer

摘要

An apparatus for polishing edge chamfers of a semiconductor wafer to mirror gloss, having a rotatory cylindrical buff formed with annular groove(s) in its side and a wafer vacuum holder capable of holding and turning the wafer circumferentially, wherein the cylindrical buff is adapted to shift axially, and the annular groove has a width substantially greater than the thickness of the wafer, and a drive mechanism for axially biasing the cylindrical buff is provided.