| 摘要 |
<p>PURPOSE:To realize high density of a circuit board by soldering a surface mounting parts to a through hole of a multilayer electronic circuit substrate. CONSTITUTION:The titled multilayer circuit board contains one or more blind through holes, wherein each layer of a multilayer printed wiring board is bonded together with resin in between, and filled with resin, and then its surface is covered with a conductive material. In addition, one or more solder lands 6 of a surface mounting part (SMD) contain the blind through hole part. The figure shows a sectional structure of SMD soldering on the blind through hole, wherein a means for jointing hard the soldering land 6 to the board of printed wiring board by utilizing the end part of the blind through hole is shown. By soldering SMD on the blind through hole, higher density of the circuit board can be realized without troubles in mounting process and reliability.</p> |
