发明名称 EPOXY-RESIN MOLDING MATERIAL FOR SEALING
摘要 PURPOSE:To obtain a molded body which is provided with a good light- transmitting property by a method wherein spherical silica, in a specific quantity, which is provided with a specific average particle size is contained as a filler. CONSTITUTION:In an epoxy-resin molding material for sealing, spherical silica, as a filler, in an average particle size of 0.1 to 50mum is contained within a range of 10 to 100wt.% in terms of the amount of the filler. Thereby, a light- transmitting property can be improved. In addition, crushed molten silica in an average particle size of 10 to 20mum is contained within a range of 0 to 70wt.%, spherical silica in an average particle size of 5 to 30mum is contained within a range of 10 to 90wt.%, and fine spherical silica in an average particle size of 0.1 to 2mum is contained within a range of 0.1 to 10wt.%. Then, when the epoxy-resin molding material is used for a sealing operation, it is possible to obtain a molded body which is provided with a good molding property and a good light-transmitting property.
申请公布号 JPH06132427(A) 申请公布日期 1994.05.13
申请号 JP19930185374 申请日期 1993.07.27
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 ICHIKAWA MASAYA;MIYATANI YOSHIHIRO;IKEDA KOJI
分类号 C08K3/36;C08L63/00;C08L101/00;H01L23/29;H01L23/31;H01L33/56 主分类号 C08K3/36
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