| 摘要 |
PURPOSE:To avoid steps in the base and to flatten the base which is required for an interlayer insulating film for multilayer wiring, to suppress retardation of propagation and further to improve cracking resistance of the interlayer insulating film, by using a photosensitive heat-resistant resin expressed by specified formula. CONSTITUTION:The photosensitive heat-resistant resin expressed by formula is used. In formula, R<1> is an unsatd. hydrocarbon group, R<2> is a phenyl group, R<3> is hydrogen or hydrocarbon group, a-f are intergers satisfying a+d>=1, b+e>=1, a+b+c=3, and d+e+f=3, and m and n are determined to obtain 5000-20000mol.wt. of the resin. In the formula, the unsatd. hydrocarbon group R<1> is, for example, vinyl group and aryl group. R<3> is hydrogen or hydrocarbon group intrinsic to the starting material to synthesize the resin. At least one group of either unsatd. hydrocarbon group R<1> or phenyl group R<2> exists at both ends of the polymer having the mesh structure expressed by formula. |
