发明名称 |
Semiconductor device package having locating mechanism for properly positioning semiconductor device within package |
摘要 |
A semiconductor device having an IC (Integrated Circuit) chip packaged on a circuit board, and a cap for hermetically sealing the chip. The cap is bonded to the circuit board at the edges of an open end thereof and bonded to the chip at the underside or bottom thereof. To accurately position the chip on the circuit board, the circuit board is provided with a groove or a shoulder in a position where it faces the edges of the open end of the cap. After the chip has been positioned on the circuit board, the cap is bonded to the circuit board via the groove or the shoulder.
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申请公布号 |
US5311402(A) |
申请公布日期 |
1994.05.10 |
申请号 |
US19930016938 |
申请日期 |
1993.02.12 |
申请人 |
NEC CORPORATION |
发明人 |
KOBAYASHI, KENZI;MORI, HAJIME;YAMAGUTI, YUKIO |
分类号 |
H01L21/52;H01L21/58;H01L21/60;H01L23/055;H01L23/10;(IPC1-7):H05K7/02 |
主分类号 |
H01L21/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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