| 摘要 |
PURPOSE: To provide an electronic device package, which has high heat emissivity and is low cost by using a simple 'drop-in' system. CONSTITUTION: A package having a heat radiation plate 400 is made of oxygen- free steel with a high thermal conductivity and has one surface which is exposed to the outside of the package. A 'drop-in' type heat radiation plate is applied to a large number of leads and even to a chip of any size. The heat radiation plate has fins 404 for automatic matching, a slot 403 which increases the flowability of a sealant which reinforces the connection between the heat radiation plate and the sealant, and at least one rough surface which fixes the heat radiation plate and prevents entry of impurities. The exposed surface of the heat radiation plate, which prevents the sealant from bleeding and burring on the surface of the heat radiation plate which should be exposed, is pressed strongly against the bottom surface of a mold cavity by the difference between the height of the heat radiation plate and a lead frame and the depth of the corresponding mold cavity. |
