An electroconductive thermoplastic resin sheet causing no fluffing of electroconductive fibers is provided, which sheet comprises a thermoplastic resin film; a non-woven fabric or a knitted or woven fabric consisting of hot-melt-adhesive fibers and electroconductive fibers and applied and integrally melt-adhered onto one surface or both the surfaces of the film and then subjected to surface treatment; and a coating having a curing composition composed mainly of an unsaturated resin and a reactive diluent applied onto the treated surface and crosslinked and cured and having a coating thickness of 1 to 10 mu m. The electroconductive thermoplastic resin sheet is useful for packaging and in clean room technology.
