发明名称 BONDING WIRE FOR SEMICONDUCTOR ELEMENT
摘要 PURPOSE:To lower the incidence of an A-point exfoliation in a high-temperature shelf test by a method wherein the strength of an Au wire is enhanced by adding Pd, Pt, Rh, Ir, Os and Ru and their addition amount is set at a proper range. CONSTITUTION:At least one kind out of Pd, Pt, Rh, Ir, Os and Ru is added to high-purity Au at 0.003 to 0.1wt.%, at least one kind out of Sc, Y and rare- earth elements is added to it at 0.0001 to 0.05wt.%, and this mixture is melted and cast. Then, a grooved roll working operation is executed, an annealing treatment is executed in its halfway part, a wiredrawing operation is then executed, and a stress is removed sufficiently. Thereby, a bus having a wire diameter of 25mum is formed.
申请公布号 JPH06112256(A) 申请公布日期 1994.04.22
申请号 JP19920262220 申请日期 1992.09.30
申请人 TANAKA DENSHI KOGYO KK 发明人 ITABASHI KAZUMITSU;KUJIRAOKA TAKESHI
分类号 H01L21/60;C22C5/02 主分类号 H01L21/60
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