| 摘要 |
PURPOSE:To automate the automatic mounting operation of an IC chip. CONSTITUTION:An IC chip 4 to be mounted is placed on a stage 21, a thermoset resin film 12 which has been pasted on a base film 11 is fixed to a stage 22, and a panel 3 is placed on a stage 23. A suction head 24 sucks the IC chip 4 which has been placed on the stage 21, and the IC chip 4 is bonded temporarily to the resin film 12 on the stage 22. A cutter 25 cuts the resin film 12 on the stage 22 along the contour of the IC chip 4. A suction head 26 sucks the IC chip 4 to which cut pieces from the resin film 12 have been applied, the chip is placed on the panel 3 on the stage 23, the cut pieces are heated and set to a fluid state, and the IC chip 4 is bonded to the panel 3. |
