Verfahren zur Anbringung von integrierten Schaltungschips mit TAB-Struktur auf ein Substrat

摘要

In a method using chips for Tape Automated Bonding, or TAB structures, the need for particular cutting and bending tools for each type of TAB structure, as well as a particular thermod, is avoided by cutting the terminal leads of a TAB structure along the four sides by means of a general cutting tool and arranging either that the chip (2) is glued (11) to the substrate (40) and/or the remaining portions of the cut terminal leads of the TAB structure are glued to the substrate. If desirable, intermediate shielding or dielectric layers may be arranged simply . All terminals are wire-bonded (15) to the substrate TAB structures hereby may conveniently be used for low levels of production without a raised investment cost for particular and different tools for respective chips.