| 摘要 |
A lead frame, used for constructing a multi-core optical module or the like, includes a frame portion, a plurality of substrate portions on which electronic circuit elements are to be mounted, and a support portion for securing the plurality of substrate portions to the frame portion. The support portion has a plurality of separated end portions connected to the respective substrate portions at the position where a molded resin member is covered, and at least two of the plurality of end portions are combined into one body to be connected to the frame portion at the point where the molded resin member is not covered. |
