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发明名称
METHOD AND SYSTEM FOR FABRICATION RESIN SEALED SEMICONDUCTOR DEVICE
摘要
申请公布号
JPH0697343(A)
申请公布日期
1994.04.08
申请号
JP19930184575
申请日期
1993.07.27
申请人
NEC CORP
发明人
NISHIKAWA HIDEYUKI
分类号
H01L21/56;H01L23/50;(IPC1-7):H01L23/50
主分类号
H01L21/56
代理机构
代理人
主权项
地址
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