发明名称 METHOD FOR SMOOTHING RESIN FILM
摘要 <p>PURPOSE:To efficiently and easily prevent the irregularity of the smooth surface of a resin film and to obtain the resin film excellent in smoothness and stable in quality. CONSTITUTION:A resin film 13 is bonded to at least one surface of a support substrate 11 directly or through other layer and a release film 27 is placed on the resin film and the resin film is heated and pressed from above through the release film to smooth the surface of the resin film and, thereafter, the release film is peeled. In this case, the release film consists of a resin film 29, the conductive layer 40 formed on the resin film and the release agent 30 having peel strength of 10-35g/50mm applied to the conductive layer.</p>
申请公布号 JPH0691223(A) 申请公布日期 1994.04.05
申请号 JP19920240963 申请日期 1992.09.09
申请人 TOSHIBA CORP;TOSHIBA ELECTRON ENG CORP 发明人 MASUDA TAKASHI;NIKAIDO MASARU
分类号 B05D3/02;B05D3/12;G02B5/20;G02F1/1333;(IPC1-7):B05D3/02;G02F1/133 主分类号 B05D3/02
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