发明名称 Optical element manufacturing method and a wafer
摘要 An optical element manufacturing method comprises steps of: preparing a wafer having opposite surfaces the extension of which intersecting each other at a predetermined angle; irradiating the wafer with a laser beam to form fringes on the wafer and displaying the fringes on a display for observation; determining cutting lines on the wafer with reference to the positions of the fringes; and cutting the wafer along the cutting lines to obtain a plurality of optical elements. By using method mentioned above, a nonlinear optical crystal element having an inclined plane can be produced in quantities.
申请公布号 US5298718(A) 申请公布日期 1994.03.29
申请号 US19920979257 申请日期 1992.11.20
申请人 SONY CORPORATION 发明人 MASUDA, HISASHI
分类号 G02F1/35;G01B11/06;G02B1/02;G02B27/28;G02F1/355;G02F1/37;H01S3/109;(IPC1-7):B23K26/00 主分类号 G02F1/35
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