发明名称 Polishing pad with controlled abrasion rate
摘要 A polishing pad is provided, having its face shaped to produce controlled nonuniform removal of material from a workpiece. Non-uniformity is produced as a function of distance from the pad's rotational axis (the working radius). The pad face is configured with both raised, contact regions and voided, non-contact regions such that arcuate abrasive contact varies nonuniformly as a function of distance from the pad's rotational axis. Void density at any distance may be produced by several techniques such as varying void size as a function of working radius or varying the number of voids per unit area as a function of working radius. Either technique produces variation in voided area per total unit area for rings of pad surface concentric with the rotational axis having infintesimally small width.
申请公布号 US5297364(A) 申请公布日期 1994.03.29
申请号 US19910773477 申请日期 1991.10.09
申请人 MICRON TECHNOLOGY, INC. 发明人 TUTTLE, MARK E.
分类号 B24B7/22;B24B13/01;B24B37/04;B24D11/00;(IPC1-7):B24D3/00 主分类号 B24B7/22
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