| 摘要 |
PURPOSE:To improve the working efficiency of wire bonding by automatically detecting the abrasion state of the clamping surface of a cutting clamp for cutting wires. CONSTITUTION:Temporary bonding is performed on a lead 27 placed on a bonding stage 26 by using this device. At the time of the temporary bonding, electric power is supplied from a power source circuit 31 and an electric current flows through a wire 9, because a clamp 8a and the stage 26 are conductive. A current detection circuit 32 detects the change of the current flowing through the wire 9 and displays the change on a displaying means. When the detected value is stored in a control circuit, the change of the electric current with time can be checked. As a result, the abrasion state of the clamping surface of the clamp 8a can be detected based on the data detected by means of the circuit 32. Therefore, the fluctuation of drawn-out amount, etc., of the wire 9 can be eliminated and the working efficiency can be improved. |
