首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
INTEGRATED CIRCUIT MODULE WITH DEVICES INTERCONNECTED BY ELECTROMAGNETIC WAVES.
摘要
申请公布号
EP0571609(A4)
申请公布日期
1994.03.21
申请号
EP19930900953
申请日期
1992.12.08
申请人
MOTOROLA, INC.
发明人
GHAEM, SANJAR
分类号
H01L25/16;H04B10/00;H04B10/02;H04B10/10;H04B10/105;H04B10/22;H04B10/28;(IPC1-7):H04B5/02
主分类号
H01L25/16
代理机构
代理人
主权项
地址
您可能感兴趣的专利
Pressure device of fixing roller
Electrical connector retaining assembly for facilitating removable mounting of a rigid disk drive
Gram negative bacteria screening method with horseshoe crab amebocyte lysate (LAL)
High titer varicella-zoster immune globulin for intravenous administration
Novel process for making polyurethane products which require reduced crushing in preventing said products from substantially shrinking or changing dimensionally upon cooling
Method for spraying of dyes from high-boiling solvent dispersions onto open width fabric with heat setting
DRIVING CIRCUIT FOR ULTRASONIC MOTOR
ULTRASONIC MOTOR
SIGNAL SYSTEM OF EYEGLASSES FOR THREEDIMENSIONAL IMAGE
EXPANSION PIPE JOINT
SUBSCRIBER TV DISTRIBUTION SYSTEM
DOUBLE BALANCED LIGHT RECEIVER
METHOD OF WORKING ON PACKAGE
SEMICONDUCTOR DEVICE
WHEEL WITH TIRE PRESSURE MONITOR
HIGH ENERGY BEAM MACHINE
HEAT CUTTING METHOD AND ITS DEVICE
CARRIER FOR DEVELOPING ELECTROSTATIC CHARGE IMAGE
PIEZOELECTRIC ELEMENT AND ITS MANUFACTURE
PASSAGE MANAGING SYSTEM
