| 摘要 |
PURPOSE:To prevent the occurrence of defective connection between connecting terminals at both end sections. CONSTITUTION:Multiple connecting terminals 23 each made of a Au layer 23c on the surface are arranged on the lower face of a circuit board 21, and laser beam absorbing pattern 24 each made of a Ni layer 24b on the surface are provided on both outsides of the array of the connecting terminals 23. The reflection factor of Au against a YAG laser beam having the wavelength of 1mum is 98%, the reflection factor of Ni is 72%, and the laser beam absorption factor of Ni is better than that of Au. When a transparent board 11 and the circuit board 21 are connected via an anisotropic conducting adhesive 31, they are connected by pressure while the YAG laser beam having the wavelength of 1mum is radiated. The laser beam can be sufficiently absorbed by the laser beam absorbing patterns 24 to generate sufficient heat, insulating adhesives 32 at both end sections of the anisotropic conducting adhesive 31 are thoroughly softened, and both end sections of the anisotropic conducting adhesive 31 can be fully squashed. |
