发明名称 Solid state laser apparatus and laser machining apparatus
摘要 <p>A solid state laser apparatus and a laser machining apparatus are provided to provide high power laser beam having an excellent condensing performance at high efficiency and with high reliability. In the solid state laser apparatus, a recess is provided in a supporter disposed on a slab side surface at an excitation area corresponding portion. A high reflectance body having a cooling water filtrating groove is disposed in the recess to contact with a slab facing surface with pressure. The supporter contacts slab longitudinal both ends with pressure through a silicon rubber plate which is transparent to excitation light. A transparent silicon rubber O-ring is disposed to extend over an entire peripheral portion of a plane formed by a slab surface including the supporter pressure contacting porting and the supporter so as to seal cooling water and elastically support the slab.</p>
申请公布号 GB9400903(D0) 申请公布日期 1994.03.16
申请号 GB19940000903 申请日期 1994.01.18
申请人 MITSUBISHI DENKI KABUSHIKI KAISHA 发明人
分类号 B23K26/00;B23K26/06;H01S3/02;H01S3/04;H01S3/042;H01S3/05;H01S3/06;H01S3/08;H01S3/093;H01S3/094;H01S3/23 主分类号 B23K26/00
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