发明名称 |
Solid state laser apparatus and laser machining apparatus |
摘要 |
<p>A solid state laser apparatus and a laser machining apparatus are provided to provide high power laser beam having an excellent condensing performance at high efficiency and with high reliability. In the solid state laser apparatus, a recess is provided in a supporter disposed on a slab side surface at an excitation area corresponding portion. A high reflectance body having a cooling water filtrating groove is disposed in the recess to contact with a slab facing surface with pressure. The supporter contacts slab longitudinal both ends with pressure through a silicon rubber plate which is transparent to excitation light. A transparent silicon rubber O-ring is disposed to extend over an entire peripheral portion of a plane formed by a slab surface including the supporter pressure contacting porting and the supporter so as to seal cooling water and elastically support the slab.</p> |
申请公布号 |
GB9400903(D0) |
申请公布日期 |
1994.03.16 |
申请号 |
GB19940000903 |
申请日期 |
1994.01.18 |
申请人 |
MITSUBISHI DENKI KABUSHIKI KAISHA |
发明人 |
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分类号 |
B23K26/00;B23K26/06;H01S3/02;H01S3/04;H01S3/042;H01S3/05;H01S3/06;H01S3/08;H01S3/093;H01S3/094;H01S3/23 |
主分类号 |
B23K26/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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