| 摘要 |
In the method proposed, grooves (2, 3) which are connected to each other are machined in a base mould (7), the minimum width of the grooves corresponding to the "mesh size" (a) and the maximum width of the grooves corresponding to the maximum width of the lands (12) of the stencil carrier. The grooves (2, 3) are filled with liquid plastic which is allowed to cure while still in the grooves (2, 3) and then separated from the mould (7). This method makes it possible to produce plane stencil carriers simply, and is less complicated than prior art methods. |
