发明名称 |
Process for preparing printed-circuit board |
摘要 |
A process for preparing a printed circuit board. The process involves successive steps of coating a photosensitive electrodeposition coating composition onto a printed-circuit copper-clad, laminated base plate to form a photosensitive resist film, applying a pattern mask onto the photosensitive resist film, exposing to an active light, developing and etching. Also the printed-circuit copper-clad, laminated base plate is subjected to a corrosion preventing treatment after cladding or laminating and prior to the step of coating the electrodeposition coating composition thereonto with a nitrogen-containing heterocyclic compound as a corrosion inhibitor.
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申请公布号 |
US5294519(A) |
申请公布日期 |
1994.03.15 |
申请号 |
US19930022755 |
申请日期 |
1993.02.19 |
申请人 |
KANSAI PAINT CO., LTD. |
发明人 |
MORI, KIICI;FUKAWA, KIYOTAKE;MARUYAMA, TSUTOMU |
分类号 |
G03F7/26;C09D5/44;C23F1/00;C23F1/02;C23F11/00;C25D13/20;G03F7/11;G03F7/16;H05K3/06;H05K3/28;(IPC1-7):G03F7/26 |
主分类号 |
G03F7/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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