发明名称 |
Method and apparatus for inspecting solder portions using fuzzy inference |
摘要 |
An image of the solder portion is taken. Values of goodness/poorness judgment factors are calculated from the image of the solder portion. Grades of the goodness/poorness judgment factors are calculated from the values of the goodness/poorness judgment factors and from predetermined membership functions of the goodness/poorness judgment factors according to predetermined rules each having a condition part related to the goodness/poorness judgment factors and a conclusion part related to a goodness degree. Partial figures are calculated from predetermined membership functions of the goodness degree and from the calculated grades of the goodness/poorness judgment factors. The partial figures are combined into a final figure. A position of a centroid of the final figure is calculated. A decision is made as to whether or not the solder portion is good on the basis of the calculated position of the centroid with respect to a predetermined judgment scale.
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申请公布号 |
US5293324(A) |
申请公布日期 |
1994.03.08 |
申请号 |
US19920867643 |
申请日期 |
1992.04.13 |
申请人 |
MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. |
发明人 |
TOKURA, NOBUFUMI |
分类号 |
G01B11/24;G01N21/88;G01N21/956;G06T1/00;G06T7/00;H04N7/18;H05K3/34;(IPC1-7):G06F15/62 |
主分类号 |
G01B11/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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