Masking material for applications in plasma etching

摘要

Materials of the lead perovskite family PbZrxTi1-xO3 have been discovered to be excellent masking materials in the etching of silicon and silicon-containing materials with chlorine and fluorine -based plasmas. Generally, materials of the lead perovskite family are suitable masking materials for any material that is etched in chlorine and fluorine -based plasmas.