发明名称 Interface conditioning insert wafer
摘要 A wafer-like insert has a plurality of holes therein which correspond to pins of an electrical connector. The wafer includes contacts for making electrical connection to the pins, connector shell or electrical components. In such manner, the wafer can be used for a wide variety of purposes such as conditioning signals carried by the pins and grounding selected pin(s) to each other and/or the connector shell. The wafer can be installed in any common electrical connector pair without prior modification or preparation of the connectors and without impairing the normal fit or function of the mated connector pair.
申请公布号 US5290191(A) 申请公布日期 1994.03.01
申请号 US19920938111 申请日期 1992.08.31
申请人 FOREMAN, KEVIN G.;KISER, WILLIE C.;LOVETT, KARIN J.;MILLER, PAUL J. 发明人 FOREMAN, KEVIN G.;KISER, WILLIE C.;LOVETT, KARIN J.;MILLER, PAUL J.
分类号 H01L23/32;G06F1/00;G06F21/00;H01L31/12;H01R9/03;H01R13/639;H01R13/66;H01R29/00;H01R31/06;H02J7/00;H05K1/02;H05K1/18;(IPC1-7):H01R13/02;H01R13/68 主分类号 H01L23/32
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