| 摘要 |
PURPOSE:To obtain a three-dimensional printed circuit board excellent in heat dissipation and electromagnetic shielding, and on which high density mounting is possible by providing a metallic plate on the back side as a multiple-layer structure. CONSTITUTION:A metallic plate 101, wiring conductors (copper foil) 103, are laminated through an insulating layers 102, 104 by using thermoplastic polyimide as insulating layers 102, 104, and a metal-base substrate of multiple layer structure is formed. Bending work and deep-drawing are made for the metal-base substrate, and the substrate is shaped into a case having an opening 180. Ridges 107, where lead terminals to be used for connection with other wiring substrate are formed, are provided on the periphery of the opening 180. The edge of the ridge 107A and the end of the lead terminal 110A are formed far separated between the two. |
