| 摘要 |
PURPOSE:To reduce thermal resistance by improving dissipation performance of a semiconductor device mounting a high-power driving semiconductor element, and to prevent deformation of an outer lead which is caused by a larger-size heat sink, and further to prevent it from becoming a larger-scale system in which the semiconductor device is mounted. CONSTITUTION:The surface forming the circuit of a semiconductor 1 is fixed on a Cu-W block 13 provided in the central part of a metal cap 6 through a polyimide film 11. |
