| 摘要 |
PURPOSE: To reduce the size of this device, and to remove unnecessary outside contacts by forming plural contacts which are used exclusively for testing on the surface of a package substrate, and positioning a semiconductor die on the package substrate. CONSTITUTION: This device is provided with a formed integrated circuit and a semiconductor die 20 having plural bond pads 18. Also, this device is provided with a means 23 for electrically connecting the plural bond pads 18 of the semiconductor die 20 for mounting the semiconductor die 20 on the upper face of a package substrate 12, with plural operating contacts and plural contacts exclusive for test. Also, the semiconductor die 20 and one part of the upper face of the package substrate 12 are sealed, and any one of pins or solder balls 26 is adhered to each one of the plural operating contacts. Thus, a semiconductor device 10 can be tested in a wide range, and the number of outside contacts can be minimized for consumers. |
