发明名称 METHOD FOR GENERAL-PURPOSE PAD PITCH LAYOUT
摘要 PURPOSE: To easily facilitate a countermeasure for a correction, corresponding to the order of a customer by arraying plural pads in each piece in the surrounding of a semiconductor die, so that the pad width of a prescribed pad can be adjusted so as to be made corresponding to a prescribed pad pitch in the column of the pads. CONSTITUTION: In a semiconductor die 300 in which a ring of pads is arranged in the surrounding of a die, plural pads 305 used with I/O sites 307-309 and 311 are arranged in two rows in each piece 301-304 according to a general pad pitch layout. A main circuit part 306, including a circuit constitution arrayed according to the specific use of a customer, is provided at the central part of the die 300, and the connection of a transistor array forming a circuit exclusively for customer is designated by the net list of the customer for transistors in a disconnected state, provided at this main circuit part 306. The number of the pads 305 to be used, pad width, and pad interval or the like are decided by a circuit which is specific to the customer, based on a grid size being a basic unit.
申请公布号 JPH0621227(A) 申请公布日期 1994.01.28
申请号 JP19930077371 申请日期 1993.03.12
申请人 MOTOROLA INC 发明人 HERUMUTSUTO SHIYUUEISU
分类号 H01L21/60;H01L21/82;H01L23/485;H01L23/50 主分类号 H01L21/60
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