发明名称 |
Solder bumping of integrated circuit die |
摘要 |
A method for forming a solder bump on an integrated circuit die utilizes a terminal (12) formed of an electrically conductive, solder-wettable composite material composed of copper particles and a polymeric binder. The terminal comprises a bond pad (24) overlying a passivation layer (20) on the die and a runner section (26) connecting the bond pad to a metal contact (16). The terminal is applied to the die, for example, as an ink by screen printing, after which a body of solder alloy is reflowed in contact with the bond pad to form the bump. A preferred material for the terminal is composed of silver-plated copper particles and a resol type phenolic binder. |
申请公布号 |
US5281684(A) |
申请公布日期 |
1994.01.25 |
申请号 |
US19920876147 |
申请日期 |
1992.04.30 |
申请人 |
MOTOROLA, INC. |
发明人 |
MOORE, KEVIN D.;MISSELE, CARL |
分类号 |
B05D7/00;C23C26/00;H01L21/60;H01L23/485;H05K3/34;(IPC1-7):C23C26/00 |
主分类号 |
B05D7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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