| 摘要 |
PURPOSE:To prevent a dispersion medium generated by a laser abrasion from adhering to the inside of a via hole or the surface of a resin film by allowing gas of N2, etc., to flow. CONSTITUTION:A via hole 3 is formed on a resin film 2 of a base plate 1. By irradiating a prescribed position with a laser light 7 through a transparent mask 5 formed with a multilayered reflecting film 6, a laser abrasion is executed. In this case, by allowing a gas flow 9 of N2, O2, He, etc., to flow to a gas flow passage formed between the mask 5 and the base plate 1, a decomposition product generated from the resin film 2 by the laser abrasion is eliminated. In this case, when the direction of the gas flow 9 is set not to be opposite the advance direction of the laser light 7, adherence of the decomposition product of the resin film 2 by the laser abrasion to the formed via hole and the surface of an insulating film is prevented. |
