| 摘要 |
PURPOSE: To connect a one-chip carrier to another chip carrier to each other by solder junction in a three-dimensional multiple-chip module(MCM) that can be laminated. CONSTITUTION: In an upper chip carrier, solder balls 23 are provided at the lower surface of a substrate 46. In a lower chip carrier, solder balls 16 are provided at the upper surface of the substrate, and solder balls 15 are provided at the lower surface. A lid 60 is used, and a device 50 can be sealed. The height of the lid serves the role of a natural stand-off projection between the levels of the carriers and serves the role of a sandglass-shaped solder junction 29, which extends the withstanding life time of the junction to the maximum. A heat sink, which further enhances the thermal dissipation of the MCM, can be readily applied in this laminating method. Furthermore, since each substrate can mount a plurality of chips, the module can accept the increases in three- dimensional chip density, at the same time as the increase in a flat-plane chip density. |
