| 摘要 |
PURPOSE:To restrain the occurrence of a fracture including a cut and a chip in a bevelling device for finishing the periphery of a wafer by moving the wafer rotating with a feed roller to a workpiece machining position with a guide roller. CONSTITUTION:A semi-conductor wafer 11 is retained at both sides by a pair of guide members 12 having a deep groove 12a, supported by a feed roller 13 of special rubber make and having a deep groove 13a, kept in posture between the guide members 12 opposite to each other in a rotary direction, given a rotary force by the rotation of the roller 13 and machined in peripheral edge on a grinding roller 14. In this case, the wafer 11 gets in contact with the grinding roller 14 due to the own weight during a machining process and the grinding roller 14 undergoes extremely low and constant pressure. Consequently, a fracture including a crack, a cut and a chip liable to occur during the machining process can be restrained substantially. |
