| 摘要 |
<p>PURPOSE:To lighten the heat stress applying to a semiconductor tip, to prevent the deviation of positional relation of the members to be joined from generating, and together to shorten the time when the solder material is solidified while keeping the temperature nearby the melting temperature by keeping the interval of the semiconductor tip and the base material after joining in the prescribed value. CONSTITUTION:A semiconductor tip 1 and a lead frame 2a are arranged through the solder material composed of the 1st solder 6 and the 2nd solder 7a, 7b, and the semiconductor tip 1 and the lead frame 2a are joined by applying the temperature lower than the melting point of the 1st solder, higher than the melting point of the 2nd solder 7a, 7b and melting the 2nd solder 7a, 7b. Then, the 2nd solder 7a, 7b is solidified by lowering the heating temperature, or while keeping the initial melting temperature, it is solidified due to the elevation of melting point caused by the change of composition of the 2nd solder 7a, 7b.</p> |
