发明名称 |
PARALLEL-FLOW AIR SYSTEM FOR COOLING ELECTRONIC EQUIPMENT. |
摘要 |
<p>The present disclosure describes an air cooling system which has the ability to maintain acceptable temperature levels in present day high density electronic equipment. More specifically, the system provides an arrangement whereby each printed circuit card has its own ducting structure affixed thereto to form an integral unit. Cooling air streams are directed simultaneously from individual apertures in the ducting structure upon a respective plurality of integrated circuit package assemblies mounted on the card.</p> |
申请公布号 |
EP0274486(B1) |
申请公布日期 |
1994.01.05 |
申请号 |
EP19870904176 |
申请日期 |
1987.06.08 |
申请人 |
UNISYS CORPORATION |
发明人 |
SMITH, GRANT, MERRELL;ROMANIA, SAMUEL, RICHARD;GIBBS, RONALD, THOMAS |
分类号 |
H05K7/20;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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