发明名称 |
Bonding metal members with multiple laser beams |
摘要 |
A first laser beam and a second laser beam with a longer wavelength than the first laser beam are directed at a first metal member in contact with a second metal member. At the ambient temperature the first member has high absorption of energy from the first laser beam but low absorption of energy from the second laser beam. As the first member absorbs energy from the first laser beam the temperature of the first member increases and the reflectivity of the first member decreases so that the first member has high absorption of energy from the second laser beam. The first member then absorbs energy from the second laser beam, the temperature of the first member further increases and at least one of the members melts. After discontinuing the laser beams a solid bond forms between the members.
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申请公布号 |
US5272309(A) |
申请公布日期 |
1993.12.21 |
申请号 |
US19920822273 |
申请日期 |
1992.01.17 |
申请人 |
MICROELECTRONICS AND COMPUTER TECHNOLOGY CORPORATION |
发明人 |
GORUGANTHU, RAMA R.;SPLETTER, PHILIP J. |
分类号 |
B23K26/06;B23K26/067;B23K26/32;H01S3/093;H01S3/109;(IPC1-7):B23K26/00 |
主分类号 |
B23K26/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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