| 摘要 |
PURPOSE:To obtain a semiconductor device having high characteristics at low cost wherein the chip area is to be cut down by removing respective patterns of inductor and capacitor from an integrated circuit substrate having high-frequency integrated circuit. CONSTITUTION:Respective patterns of an inductor 2 and a capacitor 3 are provided on a laminated ceramic substrate 9 as a mother body of a package containing a high-frequency integrated circuit and then these patterns are removed from an integrated circuit substrate 8 whereon the high-frequency integrated circuit is formed so as to cut down the chip area. |
