| 摘要 |
<p>PURPOSE:To provide a clamping mechanism which can always clamp by the same force even if the size of a wafer is larger or smaller in an improvement of the mechanism to be used to clamp a wafer of various sizes. CONSTITUTION:The clamping mechanism comprises a guide rod 3 provided between blocks provided on a board 1, a slide block 5 engaged with the rod 3 and slidable along the rod 3 by a compression spring 4, and an air cylinder 6 provided on the board 1 to slide the block 5 along the rod 3 against the spring 4. Further, the mechanism comprises a rotary block 8 coupled to the block 5 via a pin 7, a clamper 9 provided at one end of the block 8 to clamp a wafer 12, and a stop rail 11 having a connection part 11a to be connected with a connection part 8a of the block 8.</p> |
