发明名称 Kühlsystem für eine elektronische Schaltungsanordnung.
摘要 In an electronic circuit device including a printed circuit board (9) having mounted thereon an electronic circuit component (7), and also including a cooling module having biasing means (5) arranged to urge a heat transfer surface (3) of the module resiliently towards the said circuit component, there is sandwiched between that component and the heat transfer surface a thermally-conductive medium (31) of a kind that is molten at normal operating temperatures of the said electronic circuit device, thereby to facilitate heat transfer to the cooling module from the circuit component when the device is in use.
申请公布号 DE3688962(T2) 申请公布日期 1993.12.09
申请号 DE19863688962T 申请日期 1986.10.03
申请人 FUJITSU LTD., KAWASAKI, KANAGAWA, JP 发明人 YAMAMOTO, HARUHIKO, YOKOHAMA-SHI KANAGAWA 222, JP;SUZUKI, MASAHIRO, INAGI-SHI TOKYO 206, JP;UDAGAWA, YOSHIAKI, TOKYO 155, JP;NAKATA, MITSUHIKO SHIGETSU HAIMU 302, KAWASAKI-SHI KANAGAWA 214, JP;KATSUYAMA, KOJI, YOKOHAMA-SHI KANAGAWA 241, JP;ONO, IZUMI, HACHIOJI-SHI TOKYO 192, JP;KIKUCHI, SHUNICHI, YOKOHAMA-SHI KANAGAWA 223, JP
分类号 G02F1/00;G11B5/64;G11B11/105;H01L23/433;H01L23/473;H05K7/20;(IPC1-7):H05K7/20;H01L23/46 主分类号 G02F1/00
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