| 摘要 |
PURPOSE:To provide a highly reliable hybrid integrated circuit device on which a multipined and narrow-pitched semiconductor chip can be mounted easily as a result of accomplishment of large capacitance and miniaturization of the device. CONSTITUTION:The title hybrid integrated circuit device is composed of a first wiring substrate 1a, a semiconductor chip 2 which is mounted on the surface of the prescribed region of the first wiring substrate 1a surrounding the region where the semiconductor chip 2 is mounted, bonding parts 3a and 3b corresponding to the electrode terminal of the semiconductor chip 2 which is provided by alternately dividing into the first wiring substrate surface 1a surrounded by the second wiring substrate 1b, and the second wiring substrate surface 1b. Bonding wires 4a and 4b with which the bonding parts 3a and the electrode terminal of the semiconductor element are electrically connected, and a sealing body 6, which is arranged on the surface of the wiring substrate in such manner that the semiconductor chip 2, including the bending wires 4a and 4b, are hermetically sealed in one body, are also provided in the title integrated circuit device. |
