| 摘要 |
The semiconductor chip (10) is provided with bumps (16) each formed by alternately building up two types of metal materials capable of forming an eutectic alloy, and, therefore, an eutectic alloy reaction takes place at each boundary surface between two layers (14, 15). The entire bump (16) fully melts in the reaction so that the semiconductor chip (10) may be securely connected on the substrate. <IMAGE> |
