发明名称 |
RADIATION SENSITIVE RESIN COMPOSITION |
摘要 |
PURPOSE:To obtain a radiation sensitive resin compsn. having high sensitivity to radiation and excellent resistance to reactive ion etching with O2. CONSTITUTION:This radiation sensitive resin compsn. is a mixture of 0.5g polysiloxane having 5,600wt. average mol.wt. and 1.5 specific dispersion with 50 mg triphenylsulfonium trifluoromethanesulfonate and 4ml 2-ethyl methoxyacetate as a solvent. The polysiloxane is a random copolymer contg. monomeric units represented by formula I and monomeric units represented by formula II and having a trimethylsilyl group at a terminal and 3:1 copolymn. ratio between p-hydroxy-m-allylphenetyl and t-butoxyl. In the formula II, R is an acid decomposable protective group having C forming an Si-O-C bond to Si in the skeleton of polysiloxane. |
申请公布号 |
JPH05323612(A) |
申请公布日期 |
1993.12.07 |
申请号 |
JP19920132860 |
申请日期 |
1992.05.25 |
申请人 |
OKI ELECTRIC IND CO LTD |
发明人 |
ITO TOSHIO;SAKATA YOSHIKAZU |
分类号 |
C08K5/00;C08L83/04;C08L83/07;G03F7/004;G03F7/029;G03F7/038;G03F7/075;G03F7/26;H01L21/027;(IPC1-7):G03F7/075 |
主分类号 |
C08K5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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