| 摘要 |
<p>PURPOSE:To protect a considerably long slip from being generated in a semiconductor substrate by setting supporting points for the semiconductor substrate, specially two supporting points distant by the diameter of the semiconductor substrate from each other, in a boat that is used as a vertical heat treating furnace for semiconductor substrates. CONSTITUTION:A supporting boat that is used when executing heat treating of semiconductor substrates has fixed shaft 5 for supporting a nearly half section of the circumference of semiconductor substrate 1 in a plurality of points, and mobile shaft 6 for supporting nearly the rest half of the circumference of the semiconductor substrate 1 after supporting the semiconductor substrate 1 with the fixed axes 5, thereby protecting the generation of the mechanical stress applied to the supporting points distant by the diameter width of the semiconductor substrate from each other by the semiconductor substrate's weight.</p> |
