| 摘要 |
A method and apparatus for bonding electrical conducting means having a body, a first lead, and a second lead to a printed circuit board having a first side and a second side. A first surface mount pad is formed on the first side of the printed circuit board. A reservoir pad is formed on the first side of the printed circuit board. A second surface mount pad is formed on the second side of the printed circuit board. A via hole is formed in the printed circuit board. The via hole runs from the first side to the second side of the printed circuit board. The via hole abuts the reservoir pad and the second surface mount pad. Bonding means is deposited onto the first surface mount pad and the reservoir pad and into the via hole but not onto the second surface mount pad. The first lead of the electrical conducting means is placed against the bonding means deposited on the first surface mount pad and the second lead of the electrical conducting means is placed below the second surface mount pad. The bonding means is heated. The bonding means is cooled.
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