| 摘要 |
PURPOSE:To thin a thin type package further by laminating an insulator sheet protecting a surface, on which an LSI is not mounted, and a conductor section without through an adhesive layer. CONSTITUTION:A reinforced resin, in which glass cloth is impregnated with resin such as epoxy, is used as a material in an insulator sheet 2 protecting a surface, on which an LSI is not mounted. A conductor section 1 and the insulator sheet 2 are positioned accurately, and laminated, thus completing a substrate. The conductor section 1 and the insulator sheet 2 are mechanically fixed previously by jigs, etc., used in the fixing process of an LSI chip 6 and a connection process by a wire such as a gold wire at that time. When an epoxy material at a B stage is employed as the material of the insulator sheet 2, the conductor section 1 and the insulator sheet 2 are temporarily fixed previously by employing a means such as heating. No section as the thickness of an adhesive layer is required, thus also allowing the formation of a thin package. |
