发明名称 MANUFACTURE OF ELECTRIC CIRCUIT MOLDING
摘要 <p>PURPOSE:To provide the manufacture for electric circuit moldings usable as physical solid wiring circuit excellent in conductivity, by directly joining plural conductive moldings. CONSTITUTION:Resin compositions, composed by blending concuctive metallic fibers and low-melting point metal with thermoplastic resin, are injection molded by using a mold having a given shape, and straight or curved rodlike conductive molding 2 and 3, having a jointing part 1, like e.g. the combination of conical recessed and protuded parts, in one side end part, are formed respectively. Next, the joining part 1 of these moldings 2 and 3 are locally heated with hot air devices respectively to expose conductive metallic fibers from surfaces. Then the joining parts 1 of both the sides are engaged and pressure-contacted, and also is heated at temperature higher than the melting point of the thermoplastic resin and the low-melting point metal to be welded with an ultrasonic welding device.</p>
申请公布号 JPH05298945(A) 申请公布日期 1993.11.12
申请号 JP19920100798 申请日期 1992.04.21
申请人 TOSHIBA CHEM CORP 发明人 FUKUMOTO HIROAKI
分类号 H01B13/00;H01R4/00;H05K3/00;H05K3/20;H05K3/32;(IPC1-7):H01B13/00 主分类号 H01B13/00
代理机构 代理人
主权项
地址