| 摘要 |
PURPOSE:To provide a method for manufacturing resin sealed semiconductor devices having high heat radiating properties which makes the sealing process suitable for automatic and inline processing and for increasing chip sizes following the increase in degree of integration of the semiconductor devices. CONSTITUTION:A sealing resin sheet 1 of an uncured resin is arranged on the active surface side of a semiconductor chip 4 connected to a lead 2d and, at the same time, a metallic material 5 is provided on the rear surface side of the chip 4 in a state where the material 5 is brought into contact with the rear surface. Then they are integrally formed by curing the uncured resin by applying a pressure from the outside of the material 5 and sheet 1. |
